John H. Lau
Springer US
1994e druk, 1994
9780442014414
Chip On Board
Technology for Multichip Modules
Specificaties
Gebonden, 556 blz.
|
Engels
Springer US |
1994e druk, 1994
ISBN13: 9780442014414
Rubricering
Levertijd ongeveer 9 werkdagen
Gratis verzonden
Samenvatting
This book is a one-stop guide to the state of the art of COB technology. For professionals active in COB and MCM research and development, those who wish to master COB and MCM problem-solving methods, and those who must choose a cost-effective design and high-yield manufacturing process for their interconnect systems, here is a timely summary of progress in al aspects of this fascinating field.
It meets the reference needs of design, material, process, equipment, manufacturing, quality, reliability, packaging, and system engineers, and technical managers working in electronic packaging and interconnection.
Specificaties
ISBN13:9780442014414
Taal:Engels
Bindwijze:gebonden
Aantal pagina's:556
Uitgever:Springer US
Druk:1994
Hoofdrubriek:Programmeren, Computer en informatica
Inhoudsopgave
Preface; Acknowledgments; A brief introduction to wire bonding, tape automated bonding, and flip chip on board for multichip module applications; Making COB testing tractable: chip pretest and system diagnostics; Chip level interconnect; wire bonding for multichip modules; Chip level interconnect: wafer bumping and inner lead bonding; Chip level interconnect: solder bumped flip chip; Chip attachment; Wire bonding chip on board; Tape automated bonding chip on board and on MCM-D; Solder bumped flip chip attach on SLC board and multichip module; Micron bump bonding chip on board; chip on board encapsulation; Underfill encapsulation for flip chip applications; Index